| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 3 | |
| #2 | Canada | 2 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Philippines | 2 | |
| #5 | Australia | 1 | |
| #6 | Hong Kong | 1 | |
| #7 | Japan | 1 | |
| #8 | Singapore | 1 | |
| #9 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Shaping of plastics | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Slepcevic Dusan | 11 |
| #2 | Tyas Anthony | 2 |
| #3 | Deyusan Surepusubiiku | 1 |
| #4 | Dusan Slepcevic | 1 |
| Publication | Filing date | Title |
|---|---|---|
| AU6506501A | Ball grid array with pre-slotted substrate | |
| US4442056A | Encapsulation mold with gate plate and method of using same | |
| US4368168A | Method for encapsulating electrical components | |
| US4332537A | Encapsulation mold with removable cavity plates |