CHO ONPA KOGYO CO innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	Japan	110
#2	United Kingdom	2
#3	United States	2
#4	WIPO (World Intellectual Property Organization)	1

#	Technology
#1	Semiconductor devices
#2	Shaping of plastics
#3	Measuring volume
#4	Analysing materials
#5	Soldering, welding and flame cutting
#6	Certain plastics
#7	Measuring mechanical vibrations
#8	Grinding or polishing devices
#9	Generating mechanical vibrations
#10	Turning

Publication	Filing date	Title
JP2020047876A	2018-09-21	Wedge bonding device
JP2019124488A	2018-01-12	Eigen value measuring device related to sound velocity of gas and component ratio measuring device using it, further global environment monitoring device using it
JP2013171964A	2012-02-21	Ultrasonic wire bonding device and ultrasonic wire bonding method
JP2010258331A	2009-04-28	Wire bonding device
JP2009113083A	2007-11-07	Ultrasonic joining tool, and fitting method for ultrasonic joining tool
JP2007194270A	2006-01-17	Bonding ribbon and bonding method using the same
JP2007103872A	2005-10-07	Wire bonding device
JP2007067342A	2005-09-02	Method of bonding wire and wire bonding apparatus
JP2007035827A	2005-07-26	Wire bonding device
JP2007019269A	2005-07-07	Xy stage and semiconductor manufacturing device having it
JP2005353903A	2004-06-11	Wire bonding device
JP2005353901A	2004-06-11	Wire bonding device
JP2001144134A	1999-11-12	Method for supporting oscillator block at bonding head of bonding machine
JP2001118879A	1999-10-15	Wire-bonding device
JP2000255504A	1999-03-03	Method and apparatus for packaging foodstuff
JP2000246803A	1999-03-03	Ultrasonic welding-cutting device
JP2000102771A	1998-09-28	Conveying mechanism of automatic washer
JPH11241934A	1998-02-26	Ultrasonic flowmeter
JPH10277485A	1997-04-09	Running water type ultrasonic washer
JPH09285702A	1996-09-09	Deaeration device for liquid