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TRIMECS CO LTD

Overview
  • Total Patents
    30
About

TRIMECS CO LTD has a total of 30 patent applications. Its first patent ever was published in 1996. It filed its patents most often in Republic of Korea, United States and Singapore. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are MICRON PREC CO LTD, SAINEKKUSU KK and FUJITSU MIYAGI ELECTRON KK.

Patent filings in countries

World map showing TRIMECS CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 25
#2 United States 3
#3 Singapore 1
#4 Taiwan 1

Patent filings per year

Chart showing TRIMECS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Han Hyo Yong 12
#2 Baek Jeong Min 7
#3 Lim Hong U 4
#4 Lim Hong Woo 3
#5 Bae Seung Seop 3
#6 Lim Hong-Woo 2
#7 Lee Yeong Gyun 2
#8 Kim Yong Woon 1
#9 Hwan Hyu-Yung 1
#10 Baek Jung Min 1

Latest patents

Publication Filing date Title
KR20030088883A substrate and semiconductor package mold therefor
KR20020032505A semiconductor molding apparatus and molding method thereof
KR20030009965A core for manufacturing air cavity type semi-conductor
KR20010068062A semi-conductor molding manufacturing device
KR20010067915A pressure tray for semi-conductor protection package
KR20010067914A semi-conductor protection package manufacturing device and method of manufacture it
KR20010044602A circuit tape attaching apparatus
KR20010044601A carrier manufacture apparatus and the method thereof
KR20010067703A tape attaching apparatus
KR20010044603A circuit-tape attaching apparatus
KR20010044604A cover-film detaching apparatus
KR20010034939A Dispensing machine for semiconductor chip
KR20020053583A Main picker of saw system
KR20020053582A Heat air dry jet and dryer of saw system
KR20020053584A Rinse Device of Saw system
KR20020031444A The method of sawing of circuit film and the equipment thereof
KR20000012737A semiconductor package mold shaping apparatus
KR100334604B1 micro BGA solderball attach system
KR20000067271A Dispensing machine for semiconductor chip
KR100285917B1 semiconductor package strip and forming method thereof