| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 23 | |
| #2 | China | 4 | |
| #3 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Surface technology and coating | |
| #4 | Measurement | |
| #5 | Machines | |
| #6 | Micro-structure and nano-technology | |
| #7 | Chemical engineering |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kobayashi Norihiro | 3 |
| #2 | Suzuki Kingo | 2 |
| #3 | Ikeda Hitoshi | 2 |
| #4 | Aga Hiroji | 2 |
| #5 | Kobayashi Makoto | 2 |
| #6 | Tanaka Koichi | 1 |
| #7 | Tominaga Hiroyoshi | 1 |
| #8 | Ose Hiroki | 1 |
| #9 | Morita Foji | 1 |
| #10 | Hayakawa Kazuo | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2005124264A1 | Wafer double-side polishing apparatus and double-side polishing method |