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GLOBAL WAFERS CO LTD

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    98,917
  • Filing trend
    ⇧ 233.0%
About

GLOBAL WAFERS CO LTD has a total of 19 patent applications. It increased the IP activity by 233.0%. Its first patent ever was published in 2009. It filed its patents most often in United States, China and Taiwan. Its main competitors in its focus markets surface technology and coating, semiconductors and machines are QMAT INC, WAFER WORKS EPITAXIAL CORP and SCIOCS CO LTD.

Patent filings in countries

World map showing GLOBAL WAFERS CO LTDs patent filings in countries
# Country Total Patents
#1 United States 11
#2 China 5
#3 Taiwan 3

Patent filings per year

Chart showing GLOBAL WAFERS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ryu Jaewoo 4
#2 Lin Manhsuan 4
#3 Hudson Carissima Marie 4
#4 Wu Chun-Sheng 3
#5 Lu Zheng 3
#6 Tsai Feng-Chien 3
#7 Chen Chi-Yung 3
#8 Tseng Hsien-Ta 3
#9 Sheu Yeong-Ming 3
#10 Xu Wenqing 3

Latest patents

Publication Filing date Title
US2020002838A1 Methods for producing a silicon ingot that involve monitoring a moving average of the ingot neck pull rate
US2020002839A1 Monitoring a moving average of the ingot neck pull rate to control the quality of the neck for ingot growth
US2020002840A1 Systems for producing a monocrystalline ingot that involve monitoring neck growth moving average
US2020002836A1 Sample rod growth and resistivity measurement during single crystal silicon ingot production
US2020002835A1 Methods for determining the resistivity of a polycrystalline silicon melt
US2020002843A1 Growth of plural sample rods to determine impurity build-up during production of single crystal silicon ingots
US2020002837A1 Methods for modeling the impurity concentration of a single crystal silicon ingot
CN108691009A The manufacturing method of monocrystalline silicon
US2018323265A1 Semiconductor heterostructures and methods for forming same
TWI620840B Slicing apparatus for silicon carbide ingot and slicing method for silicon carbide ingot
US2016307754A1 Silicon substrates with compressive stress and methods for production of the same
TW201520584A Optical device and manufacture thereof
TW201103076A Production method of gallium nitride based compound semiconductor