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SHANGHAI XIANFANG SEMICONDUCTOR CO LTD

Overview
  • Total Patents
    81
  • GoodIP Patent Rank
    17,764
  • Filing trend
    ⇧ 50.0%
About

SHANGHAI XIANFANG SEMICONDUCTOR CO LTD has a total of 81 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2017. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, telecommunications and optics are HANGZHOU MICROSILICON TECH CO LTD, SMIC SEMICONDUCTOR JIANGYIN CO LTD and RFMARQ INC.

Patent filings in countries

World map showing SHANGHAI XIANFANG SEMICONDUCTOR CO LTDs patent filings in countries

Patent filings per year

Chart showing SHANGHAI XIANFANG SEMICONDUCTOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cao Liqiang 75
#2 Sun Peng 16
#3 Li Hengfu 15
#4 Ren Yulong 9
#5 Dai Fengwei 9
#6 Zhang Kai 9
#7 Geng Fei 6
#8 Chen Feng 5
#9 Yan Yangyang 4
#10 Xu Cheng 4

Latest patents

Publication Filing date Title
CN112054036A Image sensing chip integrated structure and manufacturing method thereof
CN112117249A Wafer-level bonding structure and wafer-level bonding method
CN111900155A Modular packaging structure and method
CN111900095A Multi-chip integrated packaging method and packaging structure
CN111725154A Packaging structure of embedded device and manufacturing method
CN111653488A Micro-channel heat dissipation system and manufacturing method thereof
CN111627897A Three-dimensional packaging structure and preparation method thereof
CN111584449A Chip packaging structure and preparation method
CN111554646A Wafer-level chip structure, multi-chip stacking interconnection structure and preparation method
CN111554647A Wafer-level chip structure, multi-chip stacking interconnection structure and preparation method
CN111554676A Interposer packaging structure with enhanced local bandwidth and manufacturing method thereof
CN111446222A Wafer-level RD L metal line structure and preparation method thereof
CN111584448A Chip embedded micro-channel module packaging structure and manufacturing method
CN111477553A Isolation packaging structure and manufacturing method thereof
CN111446177A System-level packaging method and structure of heterogeneous integrated chip
CN111244050A Chip-level integrated microfluid heat dissipation module and preparation method thereof
CN111128903A Chip packaging structure and manufacturing method thereof
CN111128917A Chip packaging structure and manufacturing method thereof
CN111128948A Structure for realizing coplanarity of embedded adapter plate and substrate and manufacturing method thereof
CN111128949A Embedded adapter plate and manufacturing method of packaging structure thereof