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GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTD

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    78,566
About

GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTD has a total of 21 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, telecommunications and micro-structure and nano-technology are SEREN PHOTONICS LTD, WU DONGPING and HC SEMITEK (SUZHOU) CO LTD.

Patent filings in countries

World map showing GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTDs patent filings in countries
# Country Total Patents
#1 China 21

Patent filings per year

Chart showing GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Bin 11
#2 Lin Tingyu 9
#3 Cai Kunchen 7
#4 Cui Chengqiang 6
#5 Cui Ruibin 5
#6 Kuang Ziliang 4
#7 Li Chao 4
#8 Du Yisong 3
#9 Liu Chunping 3
#10 Lei Zhennan 3

Latest patents

Publication Filing date Title
CN112242370A MOSFET fan-out type packaging structure and manufacturing method thereof
CN112086417A Multi-chip 3D stacking packaging structure and packaging method with efficient heat dissipation
CN111668175A Board-level fan-out type heat dissipation structure, preparation method thereof and electronic component
CN111696870A Double-sided fan-out packaging method and double-sided fan-out packaging structure
CN111341681A Low-thickness 3D stacked packaging structure and preparation method thereof
CN111261532A Low RDSON three-dimensional stacking integrated packaging structure and preparation method thereof
CN111106090A TMV fan-out type packaging structure based on rigid frame and preparation method thereof
CN111029332A Fan-out type packaging structure with high heat dissipation and electromagnetic shielding performance and preparation method thereof
CN111029260A Preparation method of fan-out type three-dimensional packaging structure and fan-out type three-dimensional packaging structure
CN111128765A Method for reducing fan-out type packaging stress and plastic packaging mold applied by same
CN111048424A Packaging method and packaging structure of three-dimensional heterogeneous AIP chip
CN110600438A Embedded multi-chip and element SIP fan-out type packaging structure and manufacturing method thereof
CN110676183A Fan-out type packaging method for reducing plastic deformation of chip
CN110676178A Fan-out type packaging structure and method for embedded multi-chip integration of pre-plastic packaged chip
CN110571201A high-heat-dissipation fan-out type three-dimensional heterogeneous double-sided plastic package structure and preparation method thereof
CN110676180A Chip fan-out type packaging structure and packaging method
CN110517993A Plate grade fan-out packaging structure with high-cooling property and preparation method thereof
CN110581120A fine line structure of board-level fan-out packaging substrate and preparation method thereof
CN110620053A Fan-out type packaging structure with laser opening blocking layer and preparation method thereof
CN110571157A Method for manufacturing fine circuit capable of preventing lateral etching