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FOREHOPE ELECTRONIC NINGBO CO LTD

Overview
  • Total Patents
    90
  • GoodIP Patent Rank
    15,944
About

FOREHOPE ELECTRONIC NINGBO CO LTD has a total of 90 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, telecommunications and it methods for management are TSAI SHIANN TSONG, RFMARQ INC and HANGZHOU MICROSILICON TECH CO LTD.

Patent filings in countries

World map showing FOREHOPE ELECTRONIC NINGBO CO LTDs patent filings in countries
# Country Total Patents
#1 China 90

Patent filings per year

Chart showing FOREHOPE ELECTRONIC NINGBO CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 He Zhenghong 46
#2 Zhong Lei 31
#3 Li Li 30
#4 Pang Honglin 13
#5 Xu Yupeng 12
#6 Wang Shunbo 10
#7 Sun Jie 8
#8 Yang Liandong 6
#9 Qiu Yuanhai 4
#10 Zhang Jiqin 2

Latest patents

Publication Filing date Title
CN112234049A Photoelectric sensor, manufacturing method thereof and electronic device
CN112234047A Layered electromagnetic shielding packaging structure and manufacturing method thereof
CN112234048A Electromagnetic shielding module packaging structure and electromagnetic shielding module packaging method
CN112017976A Photoelectric sensor packaging structure manufacturing method and photoelectric sensor packaging structure
CN112018055A Electromagnetic shielding heat dissipation packaging structure and preparation method thereof
CN112015540A Program management method, device, system and readable storage medium
CN112002679A Stack packaging structure and stack packaging method
CN112289689A Semiconductor packaging structure manufacturing method and semiconductor packaging structure
CN111933635A Power module packaging structure and power module packaging method
CN111933532A Fan-out type packaging process and fan-out type packaging structure
CN111933591A Fan-out type electromagnetic shielding packaging structure and packaging method
CN111842217A Stack detection method and device, electronic equipment and readable storage medium
CN111834310A BGA heat dissipation structure and BGA heat dissipation packaging method
CN111816629A Electromagnetic shielding packaging structure and manufacturing method thereof
CN111933590A Packaging structure and manufacturing method thereof
CN111816628A Semiconductor packaging structure and packaging method
CN111739863A Fingerprint identification chip packaging structure and preparation method thereof
CN111816625A Multilayer chip stacking structure and multilayer chip stacking method
CN111710668A Semiconductor packaging structure, manufacturing method thereof and electronic equipment
CN111739873A Flexible substrate lamination packaging structure and flexible substrate lamination packaging method