TSAI SHIANN TSONG has a total of 12 patent applications. Its first patent ever was published in 2019. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets semiconductors and telecommunications are OITA NIPPON DENKI KK, GPOWER SEMICONDUCTOR INC and HUARUN SHANGHUA SEMICONDUCTOR WUXI CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 4 | |
#2 | China | 2 | |
#3 | EPO (European Patent Office) | 2 | |
#4 | Taiwan | 2 | |
#5 | Japan | 1 | |
#6 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Telecommunications |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Antennas |
# | Name | Total Patents |
---|---|---|
#1 | Tsai Chung-Che | 11 |
#2 | Tsai Hsien-Chou | 9 |
#3 | Tsai Hsien Chou | 2 |
#4 | Tsai Shiann-Tsong | 1 |
#5 | Tsai Chung Che | 1 |
Publication | Filing date | Title |
---|---|---|
US2020343196A1 | Semiconductor package and fabrication method thereof | |
US2020194382A1 | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance | |
TW202044502A | Semiconductor package with in-package compartmental shielding and fabrication method thereof | |
TW202027235A | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | |
US2020168561A1 | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | |
US2020168560A1 | Semiconductor package with in-package compartmental shielding and fabrication method thereof |