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SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD

Overview
  • Total Patents
    85
  • GoodIP Patent Rank
    31,133
  • Filing trend
    ⇩ 6.0%
About

SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD has a total of 85 patent applications. It decreased the IP activity by 6.0%. Its first patent ever was published in 2009. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, surface technology and coating and machine tools are XI AN WEIZHENG ELECTRONIC SCIENCE & TECHNOLOGY CO LTD, PLANAR SEMICONDUCTOR INC and Rugao dachang electronics co ltd.

Patent filings in countries

World map showing SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 85

Patent filings per year

Chart showing SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 He Xianhan 70
#2 Dai Hongxing 19
#3 Wang Bin 11
#4 Zhu Lin 8
#5 Chen Tianhua 5
#6 Ji Yuanjun 4
#7 Yang Qiangjun 4
#8 Zhou Yiliang 4
#9 Yu Xiaodong 3
#10 Sugihara Kazuo 3

Latest patents

Publication Filing date Title
CN111710611A Method for reducing fracture of central area of copper-clad ceramic substrate
CN111660014A Method for improving laser cutting precision of DBC substrate from back side
CN110936287A Method for reducing wire breakage rate of silicon slice
CN110993507A Method for reducing warping of copper-clad ceramic substrate mother board
CN110957207A Pre-sand blasting pretreatment method for P heavily doped silicon wafer
CN110831343A Surface treatment method for selective chemical silver deposition of DBC substrate
CN110868807A Method for keeping right angle of copper foil on DBC substrate
CN110702490A Method for purifying and analyzing silicon carbide in semiconductor slice waste liquid
CN110813881A Silicon wafer cleaning method for improving residual liquid medicine after corrosion
CN110676155A Method for detecting shallow defects on surface of polished silicon wafer
CN110767552A Thermal etching method for manufacturing AMB copper-clad ceramic substrate pattern
CN110677993A Method for keeping same cutting characteristic during cutting of copper-clad ceramic substrate
CN110379793A One kind covering copper ceramic substrate motherboard structure
CN110335807A A kind of silicon wafer cleaning method
CN110335835A Utilize the device and method of two-period form quartz nozzle cleaning silicon chip
CN110184652A A kind of chemical vapor deposition unit and method improving silicon warp degree
CN109604244A A kind of cleaning method of suitable ultra thin silicon wafers
CN109321920A A kind of strip method aoxidizing plate
CN109539782A The method of top and the sintering of bottom two-way oxygen formula high temperature sintering furnace and its oxygenation
CN109396661A One kind being used for CO2The processing method of laser aiming optical fiber processing aluminium oxide ceramics