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SEH AMERICA INC

Overview
  • Total Patents
    222
About

SEH AMERICA INC has a total of 222 patent applications. Its first patent ever was published in 1994. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets surface technology and coating, machines and semiconductors are MITSUBISHI MATERIAL SILICON, SUMITOMO MITSUBISHI SILICON and MEMC ELECTRONIC MATERIALS.

Patent filings per year

Chart showing SEH AMERICA INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Dietze Gerald R 24
#2 Kononchuk Oleg V 21
#3 Koveshnikov Sergei V 18
#4 Aydelott Richard M 17
#5 Boydston Mark R 10
#6 Radzimski Zbigniew J 10
#7 Wijaranakula Witawat 9
#8 Boyce Allen R 9
#9 Nakano Masami 9
#10 Anderson Douglas G 8

Latest patents

Publication Filing date Title
US2006211349A1 Wafer polishing template for polishing semiconductor wafers in a wax free polishing process
US2005247349A1 Low pressure check valve
US2005229857A1 Support fixture for semiconductor wafers and associated fabrication method
US2005175523A1 Ammonia reclamation system
US2005053535A1 Gettering filter and associated method for removing oxygen from a gas
US2004224477A1 Method of producing a high resistivity SIMOX silicon substrate
US2004224522A1 Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier
US2004157461A1 Method for fabricating a wafer including dry etching the edge of the wafer
US6733368B1 Method for lapping a wafer
US2003109095A1 Growth of epitaxial semiconductor material with improved crystallographic properties
US2004084042A1 Apparatus, system and method for cutting a crystal ingot
US2004060519A1 Quartz to quartz seal using expanded PTFE gasket material
US2004051882A1 Methods and apparatus for predicting oxygen-induced stacking fault density in wafers
US2004038629A1 Internal diameter cutting blades and methods
US2004023597A1 Method for seasoning a polishing pad
US2004021097A1 Method for isolation of wafer support-related crystal defects
US2004010394A1 Systems, methods and computer program products for determining contaminant concentrations in semiconductor materials
US6794227B2 Method of producing an SOI wafer
US2004000267A1 Method of determining nitrogen concentration within a wafer
US6576501B1 Double side polished wafers having external gettering sites, and method of producing same