ROKKO VENTURES PTE LTD has a total of 41 patent applications. Its first patent ever was published in 2006. It filed its patents most often in Singapore, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machines and audio-visual technology are FRY METALS INC, ROKKO SYSTEMS PTE LTD and AZDASHT GHASSEM.
# | Country | Total Patents | |
---|---|---|---|
#1 | Singapore | 15 | |
#2 | China | 7 | |
#3 | WIPO (World Intellectual Property Organization) | 7 | |
#4 | Taiwan | 5 | |
#5 | Republic of Korea | 4 | |
#6 | EPO (European Patent Office) | 1 | |
#7 | Japan | 1 | |
#8 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Audio-visual technology | |
#4 | Machine tools | |
#5 | Measurement |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Soldering, welding and flame cutting | |
#3 | Casings and printed circuits | |
#4 | Working stone | |
#5 | Unspecified technologies | |
#6 | Analysing materials |
# | Name | Total Patents |
---|---|---|
#1 | Ling Nee Seng | 14 |
#2 | Ang Soo Loo | 13 |
#3 | Jang Deok Chun | 11 |
#4 | Yang Hae Choon | 10 |
#5 | Pai Ter Siang | 7 |
#6 | Lim Chong Chen | 7 |
#7 | Jung Jong Jae | 6 |
#8 | Baek Seung Ho | 5 |
#9 | Yau Kam Hung | 5 |
#10 | Pai Luke | 5 |
Publication | Filing date | Title |
---|---|---|
SG180034A1 | System and method for offloading ic units | |
SG182188A1 | System and processing of a substrate | |
SG162631A1 | System and processing of a substrate | |
SG157985A1 | Method and apparatus for solder ball placement | |
SG10201508043VA | Method and apparatus for solder ball placement | |
SG178818A1 | Method and apparatus for solder ball placement | |
SG157241A1 | Method and apparatus for integrated circuit inspection | |
SG142402A1 | Apparatus and method for multiple substrate processing | |
SG156539A1 | A system and process for dicing integrated circuits | |
WO2008063138A2 | An improved ball mounting apparatus and method | |
SG170125A1 | An apparatus and method for dicing an ic substrate | |
SG151109A1 | An apparatus and method for dicing an ic substrate | |
SG147348A1 | Method and apparatus for solder ball mounting | |
SG143085A1 | An improved ball mounting apparatus and method |