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RICOH MICROELECTRONICS CO LTD

Overview
  • Total Patents
    336
About

RICOH MICROELECTRONICS CO LTD has a total of 336 patent applications. Its first patent ever was published in 1995. It filed its patents most often in Japan, EPO (European Patent Office) and United States. Its main competitors in its focus markets textiles and paper, semiconductors and audio-visual technology are FRY METALS INC, UNAXIS INT TRADING LTD and ATHLETE FA CORP.

Patent filings in countries

World map showing RICOH MICROELECTRONICS CO LTDs patent filings in countries

Patent filings per year

Chart showing RICOH MICROELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kinoshita Shingen 108
#2 Kobayashi Takeshi 56
#3 Takai Takuo 37
#4 Miyamoto Kazunori 25
#5 Inamura Hiroshi 20
#6 Ikeuchi Fumio 19
#7 Kinoshita Makoto 18
#8 Ogura Takabumi 15
#9 Ogawa Michio 15
#10 Moriyama Eiji 14

Latest patents

Publication Filing date Title
JP2014200902A Manufacturing method of print mask material
JP2011155307A Board transferring pallet
JP2012134269A Solder removal method and device using the same
JP2012081378A Hot melt coating apparatus
JP2012081377A Hot melt coating apparatus
JP2012081376A Hot melt coating method and its apparatus
JP2012045654A Cutting method and cutting device
JP2012049260A Cutting method and cutting device
JP2011023010A Master substrate forming device and recording medium
JP2011152712A Printing mask
JP2011129548A Jet stream type soldering apparatus
JP2010283120A Substrate cutting apparatus
JP2010251488A Substrate cutting method and substrate cutter
JP2010245317A Method of mounting electronic component
JP2010182900A Electronic component processing method and electronic component mounting method
JP2010175095A Solder material separating device and method of separating solder material by using the same
JP2008280616A Solder separation apparatus
JP2009212338A Photoelectric conversion module and method of manufacturing the same
JP2009194151A Light emitting module and production process of light emitting module
JP2009194035A Wiring board, electronic circuit board, wiring board manufacturing method, and electronic circuit board manufacturing method