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INDIUM CORP

Overview
  • Total Patents
    83
  • GoodIP Patent Rank
    22,969
  • Filing trend
    ⇧ 12.0%
About

INDIUM CORP has a total of 83 patent applications. It increased the IP activity by 12.0%. Its first patent ever was published in 1943. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, machine tools and materials and metallurgy are AYUMI INDUSTRY, FRY METALS INC and MAEDA TADASHI.

Patent filings per year

Chart showing INDIUM CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Ning-Cheng 51
#2 Zhang Hongwen 19
#3 Liu Weiping 13
#4 Chen Sihai 8
#5 Hisert James E 6
#6 Geng Jie 5
#7 Ross Jordan P 5
#8 Ross Jordan Peter 5
#9 Jarrett Robert N 5
#10 Chen Fen 5

Latest patents

Publication Filing date Title
US2021053122A1 Thermally decomposing build plate for facile release of 3d printed objects
US2020346307A1 Solder preform with internal flux core including thermochromic indicator
WO2020176583A1 High reliability leadfree solder alloys for harsh service conditions
US2020235033A1 Lead-free solder paste as thermal interface material
WO2020047481A1 Snbi and snin solder alloys
US2021047710A1 Ge-doped ausn solder alloys
US2020353572A1 Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
KR20210014200A Prevents failure of post reflow interconnects in VIPPO solder joints through the use of adhesive materials
US2020230750A1 Lead-free solder paste for thermal via filling
US2019128953A1 Burn-in preform and method of making the same
CN110557937A Flux effective to inhibit non-wetting opening in BGA assemblies
US2019366486A1 Hybrid high temperature lead-free solder preform
US2019172726A1 Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
US2018361518A1 Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachment
US2017271294A1 Spacer particles for bond line thickness control in sintering pastes
US9741676B1 Tin-indium based low temperature solder alloy
EP3291942A1 High reliability lead-free solder alloys for harsh environment electronics applications
US2016325384A1 High reliability lead-free solder alloys for harsh environment electronics applications
US2017317046A1 Nanomicrocrystallite paste for pressureless sintering
US2017266765A1 Hybrid lead-free solder wire