Learn more

FRY METALS INC

Overview
  • Total Patents
    192
  • GoodIP Patent Rank
    233,416
About

FRY METALS INC has a total of 192 patent applications. Its first patent ever was published in 1985. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets audio-visual technology, machine tools and semiconductors are MACKAY JOHN, PAC TECH GMBH and INDIUM CORP.

Patent filings per year

Chart showing FRY METALS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Singh Bawa 59
#2 Khaselev Oscar 33
#3 Marczi Michael T 32
#4 Lewis Brian 27
#5 Lewis Brian G 20
#6 Desai Nitin 18
#7 Sarkar Siuli 15
#8 Schneider Alvin F 15
#9 Wilson Mark 14
#10 Pandher Ranjit 14

Latest patents

Publication Filing date Title
CN104203490A Solder preforms and solder alloy assembly methods
KR20140063662A Solder compositions
WO2010036953A2 Lead-free conductive compositions and methods of using them
US2009081823A1 Electroformed stencils for solar cell front side metallization
CN101803016A Methods for attachment and devices produced using the methods
EP1975946A1 Devices & methods for producing & using electrical conductors
US2008159904A1 Solder alloy
WO2008073432A2 No flow underfill process, composition, and reflow carrier
WO2008049006A2 Materials for use with interconnects of electrical devices and related methods
CN101622094A Flux formulations
WO2008036752A2 Solvent systems for metals and inks
WO2007023284A1 Reducing joint embrittlement in lead-free soldering processes
US2008032047A1 Particles and inks and films using them
WO2006138367A2 Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
TW200706704A Mask and method for electrokinetic deposition and patterning process on substrates
US2006192182A1 Preparation of metallic particles for electrokinetic or electrostatic deposition
US2006175703A1 Thermally responsive pressure relief plug and method of making the same
US2005184129A1 Solder preforms for use in electronic assembly
US2006042076A1 Bus bar system for heatable glass
US2006030682A1 Low voiding no flow fluxing underfill for electronic devices