Arrangement and method for applying solder balls to a substrate
US2014027418A1
Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium
DE102010024314A1
Fluid dispensing channel, has funnel-shaped structure for guiding dispensing fluid into needle or into outlet opening, and accumulation area for collecting coarse foreign material, where opening does not lie at deepest point of channel
DE102010014001A1
Optical structure for detection of contacted electrodes and chips from horizontal position by mirror, has integrated coaxial light and backlight, where mirror is mounted in holder
DE4329936A1
Plug-in multichip module with integrated cooling system
