ATHLETE FA CORP has a total of 52 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, China and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are ATHLETE FA KK, KYOKUTOKU KAGI KOFUN YUGENKOSHI and THERMALLOY INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 16 | |
#2 | China | 15 | |
#3 | Taiwan | 12 | |
#4 | United States | 5 | |
#5 | WIPO (World Intellectual Property Organization) | 4 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Surface technology and coating | |
#4 | Machine tools | |
#5 | Machines | |
#6 | Measurement | |
#7 | Textiles and paper |
# | Name | Total Patents |
---|---|---|
#1 | Kawakami Shigeaki | 17 |
#2 | Yazawa Ichiro | 12 |
#3 | Nebashi Toru | 11 |
#4 | Naito Kenji | 7 |
#5 | Kamijima Naoto | 7 |
#6 | Miyasaka Kengo | 5 |
#7 | Shigeaki Kawakami | 5 |
#8 | Yamagishi Akitaka | 5 |
#9 | Kotake Toshiyuki | 5 |
#10 | Takeuchi Masao | 4 |
Publication | Filing date | Title |
---|---|---|
CN109309011A | Cylindrical component loading device and cylindrical component method for loading | |
WO2016174966A1 | Bundled wire-like member, ball transfer head, ball loading device, and ball loading method | |
WO2015146442A1 | Method and device for joining electronic component | |
TW200805537A | Ball filling device and method | |
KR20070116704A | System for coating resin | |
TW200601476A | Method and device for mounting conductive ball | |
KR20040030269A | Method and apparatus for bonding electronic components |