| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Singapore | 5 | |
| #2 | China | 3 | |
| #3 | Taiwan | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 | |
| #5 | Malaysia | 1 | |
| #6 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Punching metal |
| # | Name | Total Patents |
|---|---|---|
| #1 | Fang Shen Xue | 6 |
| #2 | Shen Xue Fang | 5 |
| #3 | Zhang Jing | 5 |
| #4 | Lim Chong Chen Gary | 4 |
| #5 | Jing Zhang | 4 |
| #6 | Lim Siok Chun | 3 |
| #7 | Loo Ang Soo | 2 |
| #8 | Shin Yun Suk | 2 |
| #9 | Jang Deok Chun | 2 |
| #10 | Chun Jang Deok | 2 |
| Publication | Filing date | Title |
|---|---|---|
| SG189795A1 | Punch singulation system and method | |
| SG169913A1 | Punch singulation system and method | |
| SG10201608682YA | Punch singulation system and method | |
| SG164306A1 | Assembly and method for improved singulation | |
| SG143997A1 | A clamping assembly |