A method for determining a reference height of a dispensing nozzle.
CH707125A1
Elongated tool for distributing solder during assembling semiconductor chip on metallic substrate, has work surface that is coated with a material which is different from tool portion material and is comparatively wettable with solder
CH706426A1
A process for the preparation and / or monitoring the mounting of semiconductor chips and assembly machine for semiconductor chips.
CH705035A2
Method for dispensing solder on a substrate and method for mounting a semiconductor chip.
CH706280A1
A method for detaching a semiconductor chip from a foil.
CH705930A1
A method for applying adhesive to a substrate.
CH705802A1
Means for the mounting of semiconductor chips.
CH705229A1
Method and apparatus for the assembly of semiconductor chips.
CH704991A1
Soldering method for dispensing solder on substrate when mounting semiconductor chips on metallic substrate such as leadframe involves applying ultrasonic sound to pin to produce ultrasonic waves in pin
CH704254A1
A method of coating an adhesive pattern on a substrate by means of a movable writing nozzle along a predetermined path.
US2010233369A1
Method Of Forming A Paste Pattern
SG163493A1
Die ejector
CN102217052A
Method for detaching and removing semiconductor chip from tape
MY150953A
Die-ejector
DE102009040137A1
Illuminating device for recording image of die in vision system that is utilized for aligning die in die bonder, has scattering centers pseudo randomly arranged at surface of plate such that light coupled into plate is scattered by surface
CH699851A1
Die ejector for mounting semiconductor chips from foil in frame, has path-like opening that is different from plate to plate such that plates are displaced in predetermined sequence in desired direction when pin is moved along path
CH698334A1
A process for the removal and installation of a wafer table provided on the semiconductor chip on a substrate.
CH698828B1
Wire clamp for a wire bonder.
CH698293B1
Process to regulate the quantity of adhesive discharged to the interface between semiconductor and substrate
CH698491B1
A method for setting up a machine for the assembly of semiconductor chips.
