SUSS MICROTEC INC has a total of 25 patent applications. Its first patent ever was published in 2003. It filed its patents most often in WIPO (World Intellectual Property Organization), Republic of Korea and United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are ALPHASEM AG, ESEC AG and UNAXIS INT TRADING LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 11 | |
#2 | Republic of Korea | 5 | |
#3 | United States | 5 | |
#4 | China | 2 | |
#5 | Japan | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Audio-visual technology | |
#4 | Machine tools | |
#5 | Surface technology and coating | |
#6 | Optics | |
#7 | Micro-structure and nano-technology |
# | Name | Total Patents |
---|---|---|
#1 | George Gregory | 7 |
#2 | Hughlett Emmett | 6 |
#3 | Johnson Hale | 6 |
#4 | Hermanowski James | 5 |
#5 | Gormley Gerard | 4 |
#6 | Hale Johnson | 3 |
#7 | Stiles Matthew | 3 |
#8 | Gorun Patrick | 3 |
#9 | Emmett Hughlett | 3 |
#10 | Price Thomas | 3 |
Publication | Filing date | Title |
---|---|---|
CN102934217A | Automated thermal slide debonder | |
WO2010121068A2 | Improved apparatus for temporary wafer bonding and debonding | |
US2010264566A1 | Rapid fabrication of a microelectronic temporary support for inorganic substrates | |
US2010089978A1 | Method and apparatus for wafer bonding | |
US2008285059A1 | Apparatus and method for in-situ monitoring of wafer bonding time | |
KR20100015876A | Apparatus and method for semiconductor wafer bumping via injection molded solder | |
KR20090128407A | Apparatus and method for semiconductor wafer bumping via injection molded solder | |
US2006191640A1 | High-throughput bond tool | |
US6829988B2 | Nanoimprinting apparatus and method |