| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 11 | |
| #2 | Taiwan | 3 | |
| #3 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Tools for connecting or disengaging |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kaku Yokou | 4 |
| #2 | Doi Kimio | 3 |
| #3 | Hamano Makoto | 3 |
| #4 | Shiono Masahito | 2 |
| #5 | Terasawa Yukihiko | 2 |
| #6 | Takeda Fumihiro | 1 |
| #7 | Teramoto Takashi | 1 |
| #8 | Yokosuka Noriyoshi | 1 |
| #9 | Hashizume Michihiro | 1 |
| #10 | Suzuki Narikazu | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2001077079A | Etching treatment and device | |
| JP2000332153A | Method for cleaning solder bump forming surface of wafer-level csp | |
| JP2000232089A | Method and device for etching one-side surface of wafer | |
| JP2000138193A | Method of preventing adhesion of deposit on mount plate | |
| JP2000127034A | Wafer sticking method to mount plate and its device | |
| JP2000005982A | Method for forming reference plane of sliced wafer | |
| JPH11354493A | Method and apparatus for etching notch of wafer | |
| JPH11254316A | Wafer mounting device | |
| JPH11195630A | Chuck for brush scrubber | |
| JPH11168079A | Brush scriber | |
| JPH11111824A | Wafer take-off device |