| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 19 | |
| #2 | Republic of Korea | 6 | |
| #3 | Japan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating | |
| #3 | Machines | |
| #4 | Audio-visual technology | |
| #5 | Basic communication technologies | |
| #6 | Optics | |
| #7 | Electrical machinery and energy |
| # | Name | Total Patents |
|---|---|---|
| #1 | Maki Hiroshi | 5 |
| #2 | Hanada Kenji | 4 |
| #3 | Nakayama Fumitaka | 3 |
| #4 | Hoshino Yutaka | 3 |
| #5 | Suzuki Hiromichi | 3 |
| #6 | Uchiyama Tetsuo | 3 |
| #7 | Morikawa Masatoshi | 3 |
| #8 | Kuratomi Bunshi | 2 |
| #9 | Matsuzawa Tomoo | 2 |
| #10 | Hirasawa Wataru | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US7087977B2 | Semiconductor device including multiple wiring layers and circuits operating in different frequency bands | |
| US7005310B2 | Manufacturing method of solid-state image sensing device | |
| JP2003273507A | Board mounting method for electronic component |