| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 14 | |
| #2 | China | 6 | |
| #3 | United States | 4 | |
| #4 | WIPO (World Intellectual Property Organization) | 4 | |
| #5 | Japan | 3 | |
| #6 | Taiwan | 3 | |
| #7 | EPO (European Patent Office) | 1 | |
| #8 | Hong Kong | 1 | |
| #9 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Surface technology and coating | |
| #4 | Optics | |
| #5 | Audio-visual technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lin Chao-Kun | 10 |
| #2 | Lester Steven D | 8 |
| #3 | Lin Chao Kun | 7 |
| #4 | Yang Long | 5 |
| #5 | Yan Li | 4 |
| #6 | Zhang Ling | 4 |
| #7 | Chuang Chih Wei | 4 |
| #8 | Ramer Jeff | 4 |
| #9 | Chen Zhen | 3 |
| #10 | Lester Steven | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO2014011419A1 | Submount for led device package | |
| CN103608939A | Light emitting devices having shielded silicon substrates | |
| CN103636008A | Light emitting devices having light coupling layers | |
| CN103594595A | Light-emitting device with improved electrode structures |