QUALCOMM SWITCH CORP has a total of 20 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2012. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, basic communication technologies and electrical machinery and energy are POLAR SEMICONDUCTOR LLC, SUZHOU ORIENTAL SEMICONDUCTOR CO LTD and MALLIKARJUNASWAMY SHEKAR.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 11 | |
#2 | WIPO (World Intellectual Property Organization) | 5 | |
#3 | China | 2 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Basic communication technologies | |
#3 | Electrical machinery and energy | |
#4 | Control |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Pulse technique | |
#3 | Systems for regulating electrical variables | |
#4 | AC and DC conversion devices |
# | Name | Total Patents |
---|---|---|
#1 | Stuber Michael A | 12 |
#2 | Molin Stuart B | 9 |
#3 | Goktepeli Sinan | 5 |
#4 | Nygaard Paul A | 4 |
#5 | Aubain Max | 3 |
#6 | Fowler Peter | 3 |
#7 | Drucker Mark | 3 |
#8 | Lou Perry | 2 |
#9 | Imthurn George | 1 |
#10 | Brindle Chris | 1 |
Publication | Filing date | Title |
---|---|---|
US2018061763A1 | Device performance improvement using backside metallization in a layer transfer process | |
WO2016138032A1 | Semiconductor structure with trl and handle wafer cavities | |
US2015270161A1 | Bonded semiconductor structure with SiGeC/SiGeBC layer as etch stop | |
US2015069511A1 | Semiconductor-on-insulator with back side strain topology | |
US2016105169A1 | Low power externally biased power-on-reset circuit | |
US2016056373A1 | Integrated phase change switch | |
US2014175637A1 | Back-to-back stacked integrated circuit assembly and method of making |