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THIRD DIMENSION 3D SC INC

Overview
  • Total Patents
    35
About

THIRD DIMENSION 3D SC INC has a total of 35 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors are INFINEON TECHNOLOGIES BIPOLAR GMBH & CO KG, KAO CHING-HUNG and SHANGHAI ADVANCED SEMICONDUCTOR MFG CO LTD.

Patent filings in countries

World map showing THIRD DIMENSION 3D SC INCs patent filings in countries
# Country Total Patents
#1 United States 18
#2 WIPO (World Intellectual Property Organization) 6
#3 EPO (European Patent Office) 5
#4 Taiwan 4
#5 China 1
#6 Japan 1

Patent filings per year

Chart showing THIRD DIMENSION 3D SC INCs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Hshieh Fwu-Iuan 22
#2 Pratt Brian D 11
#3 Blanchard Richard A 6
#4 So Koon Chong 5
#5 Chen Xingbi 2
#6 Chen Xing-Bi 2
#7 Hshieh Fwu-Luan 2
#8 Pratt Brain D 1
#9 Fwu-Iuan Hshieh 1

Latest patents

Publication Filing date Title
US2006134867A1 Technique for forming the deep doped regions in superjunction devices
US2006226494A1 Tungsten plug drain extension
TW200629429A Process for high voltage superjunction termination
WO2005060676A2 A method for manufacturing a superjunction device with wide mesas
EP1721344A2 Method of manufacturing a superjunction device
WO2005065140A2 Method of manufacturing a superjunction device with conventional terminations
EP1706899A2 Planarization method of manufacturing a superjunction device
US2005139914A1 Method for forming thick dielectric regions using etched trenches
US6635906B1 Voltage sustaining layer with opposite-doped islands for semi-conductor power devices