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PHILIPS SEMICONDUCTOR INC

Overview
  • Total Patents
    29
About

PHILIPS SEMICONDUCTOR INC has a total of 29 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, computer technology and optics are PHILIPS SEMICONDUCTORS INC, SHANGHAI HUALI MICROELECT CORP and HAIRYOKSA SEMICONDUCTOR CO LTD.

Patent filings in countries

World map showing PHILIPS SEMICONDUCTOR INCs patent filings in countries

Patent filings per year

Chart showing PHILIPS SEMICONDUCTOR INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lutze Jeffrey 3
#2 Annapragada Rao V 3
#3 De Muizon Emmanuel 3
#4 Ziger David 3
#5 Vines Landon 2
#6 Liu Albert H 2
#7 Mitchell Todd 2
#8 Bernasconi Eric 1
#9 Levy Paul S 1
#10 Scott Gregory S 1

Latest patents

Publication Filing date Title
US2002184558A1 Substrate noise isolation using selective buried diffusions
US2002136290A1 Pulse-width modulation with feedback to toggle module
US6319735B1 Photoresist dispense method by compensation for substrate reflectivity
US6262455B1 Method of forming dual gate oxide layers of varying thickness on a single substrate
US6302771B1 CMP pad conditioner arrangement and method therefor
US6311302B1 Method and arrangement for hierarchical control of multiple test access port control modules
US6326675B1 Semiconductor device with transparent link area for silicide applications and fabrication thereof
US6301008B1 Arrangement and method for calibrating optical line shortening measurements
US6287972B1 System and method for residue entrapment utilizing a polish and sacrificial fill for semiconductor fabrication
US6255226B1 Optimized metal etch process to enable the use of aluminum plugs
US6275886B1 Microprocessor-based serial bus interface arrangement and method
US6309804B1 Reducing contamination induced scumming, for semiconductor device, by acid treatment
US6208004B1 Semiconductor device with high-temperature-stable gate electrode for sub-micron applications and fabrication thereof
US6303192B1 Process to improve adhesion of PECVD cap layers in integrated circuits
US6202140B1 Memory addressing system and method therefor
US6085210A High-speed modular exponentiator and multiplier
US6158018A Integrated circuit including patching circuitry to bypass portions of an internally flawed read only memory and a method therefore