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ORIOL INC

Overview
  • Total Patents
    43
About

ORIOL INC has a total of 43 patent applications. Its first patent ever was published in 2001. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets semiconductors, machine tools and surface technology and coating are CETC BEIJING ELECTRONIC EQUIPMENT CO LTD, NORITAKE SUPER ABRASIVE KK and SEMINCONDUCTOR MFG SHANGHAI INTERNAT CORP.

Patent filings in countries

World map showing ORIOL INCs patent filings in countries

Patent filings per year

Chart showing ORIOL INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yoo Myung Cheol 14
#2 Jeong In Kwon 12
#3 Jeong In-Kwon 11
#4 Urbanek Wolfram 4
#5 Sung Youn-Joon 3
#6 Kim Kyong-Nam 3
#7 Kim Dong-Woo 3
#8 Yeom Geun-Young 3
#9 Atlas Boris 3
#10 Jeong Chang-Hyun 3

Latest patents

Publication Filing date Title
US6744196B1 Thin film LED
WO03015982A2 System and method for processing semiconductor wafers using different wafer processes
WO03011518A1 Cmp system and method for efficiently processing semiconductor wafers
US6841802B2 Thin film light emitting diode
US2003190770A1 Method of etching substrates
WO02078096A1 TREATING N-TYPE GaN WITH A C12-BASED INDUCTIVELY COUPLED PLASMA BEFORE FORMATION OF OHMIC CONTACTS
US6822202B2 Semiconductor processing temperature control
US6835118B2 Rigid plate assembly with polishing pad and method of using
US6949395B2 Method of making diode having reflective layer
US6949466B2 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
US6905398B2 Chemical mechanical polishing tool, apparatus and method
US6586336B2 Chemical-mechanical-polishing station
US6949177B2 System and method for processing semiconductor wafers using different wafer processes
US6575818B2 Apparatus and method for polishing multiple semiconductor wafers in parallel
KR20020066358A Multi-channel temperature control system for semiconductor processing facilities
US6942545B2 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US7225864B2 Multi-channel temperature control system for semiconductor processing facilities
US6561881B2 System and method for chemical mechanical polishing using multiple small polishing pads
US7069984B2 Multi-channel temperature control system for semiconductor processing facilities