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JIANGSU UNION SEMICONDUCTOR CO LTD

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    91,908
About

JIANGSU UNION SEMICONDUCTOR CO LTD has a total of 19 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, chemical engineering and machines are ZHANG JOHN H, SEMINCONDUCTOR MFG SHANGHAI INTERNAT CORP and CETC BEIJING ELECTRONIC EQUIPMENT CO LTD.

Patent filings in countries

World map showing JIANGSU UNION SEMICONDUCTOR CO LTDs patent filings in countries
# Country Total Patents
#1 China 19

Patent filings per year

Chart showing JIANGSU UNION SEMICONDUCTOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Meng Qiang 7
#2 Nie Wei 7
#3 Chen Zhiyuan 6
#4 Zhou Derong 5
#5 Shi Qingnan 5
#6 Xu Xuefei 4
#7 Wang Kun 4
#8 Wei Tong 4
#9 Xu Yuancheng 4
#10 Kong Fanyuan 4

Latest patents

Publication Filing date Title
CN111469005A Cutting blade back scratch processing apparatus
CN111564367A Method for processing wafer cracking abnormity before wafer grinding
CN111370352A Plasma source surface treatment device and method for improving reliability of driving chip
CN111312679A Structure for reducing projection undercut and manufacturing method thereof
CN110676219A Wafer cutting processing method for coping with vacuum abnormity
CN110665870A Device for automatically cleaning protective belt
CN110600372A Three-side cutting method for wafer
CN109946929A A kind of IC chip photoresist removal device and technique
CN109727949A A kind of silicon wafer encapsulating structure and preparation method thereof
CN109663693A A kind of spiral light blockage coating structure and its preparation facilities and method
CN109659263A A kind of wafer patch counterdie device
CN109591282A A kind of outer posting ring patch counterdie device
CN109637956A A kind of wafer conjunction frame apparatus
CN109599355A A kind of wafer closes frame and tears adhesive dispenser
CN109545728A A kind of automation wafer transfer method
CN109390265A A kind of automation wafer transfer device
CN108615688A A kind of golden bumping manufacturing process of IC chip
CN108330030A The method that the washing lotion of washout tungsten oxide and cleaning are attached with the tungsten oxide tool of production
CN103018501A Wafer test probe card