| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Grinding or polishing devices | |
| #2 | Grinding tools | |
| #3 | Working stone | |
| #4 | Semiconductor devices | |
| #5 | Sawing |
| # | Name | Total Patents |
|---|---|---|
| #1 | Toge Naoki | 52 |
| #2 | Ogata Seiya | 22 |
| #3 | Ide Daisuke | 20 |
| #4 | Inoue Yasuaki | 18 |
| #5 | Tejima Masatomo | 15 |
| #6 | Kumamoto Kenichiro | 13 |
| #7 | Niizawa Yoji | 12 |
| #8 | Matsukawa Masanori | 12 |
| #9 | Nonoshita Tetsuya | 11 |
| #10 | Iwakuma Takashi | 9 |
| Publication | Filing date | Title |
|---|---|---|
| JP2009166139A | Diamond dresser | |
| JP2009136927A | Grinding wheel | |
| JP2009083050A | Segment chip and metal bond band saw using the same | |
| JP2008246646A | Resin bond wire saw | |
| JP2008246615A | Electrodeposition wheel | |
| JP2008238369A | Cutting blade | |
| JP2008238304A | Cutting electrodeposition blade | |
| JP2008229775A | Cmp pad conditioner | |
| JP2008213102A | Brazing grinding wheel | |
| JP2008155347A | Truing tool | |
| JP2008126369A | Dicing blade | |
| JP2008073807A | Milling cutter tool | |
| JP2008073784A | cBN BRAZING GRINDING WHEEL | |
| JP2007268666A | Cmp pad conditioner | |
| JP2007268627A | Electro-deposited wire saw | |
| JP2007253285A | Super-abrasive resin bond wheel | |
| JP2007253267A | Wire saw | |
| JP2007253268A | Resinoid bond wire saw | |
| JP2007245254A | Cmp pad conditioner | |
| JP2007237349A | Rotary abrasive wheel |