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OPTOMEC DESIGN

Overview
  • Total Patents
    62
About

OPTOMEC DESIGN has a total of 62 patent applications. Its first patent ever was published in 1989. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets surface technology and coating, machines and semiconductors are BOSCHMAN TECH BV, ORMET CIRCUITS INC and SHIN ETSU ENG CO LTD.

Patent filings per year

Chart showing OPTOMEC DESIGNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Renn Michael J 38
#2 King Bruce H 23
#3 Essien Marcelino 20
#4 Keicher David M 19
#5 Paulsen Jason A 11
#6 Giridharan Manampathy G 9
#7 Bullen James L 8
#8 Sheu Jyh-Cherng 7
#9 Miller W Doyle 7
#10 Love James W 7

Latest patents

Publication Filing date Title
TW200838630A Method and apparatus for low-temperature plasma sintering
US2007154634A1 Method and Apparatus for Low-Temperature Plasma Sintering
TW200626741A Miniature aerosol jet and aerosol jet array
TW200633067A Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US2006175431A1 Miniature aerosol jet and aerosol jet array
US2006163570A1 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US2006280866A1 Method and apparatus for mesoscale deposition of biological materials and biomaterials
WO2005107981A2 Greater angle and overhanging materials deposition
US2006003095A1 Greater angle and overhanging materials deposition
US2006008590A1 Annular aerosol jet deposition using an extended nozzle
KR20060096422A Laser processing for heat-sensitive mesoscale deposition
US2005156991A1 Maskless direct write of copper using an annular aerosol jet
US2005129383A1 Laser processing for heat-sensitive mesoscale deposition
TW200516170A Laser treatment process for maskless low-temperature deposition of electronic materials
US2004197493A1 Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
US7045015B2 Apparatuses and method for maskless mesoscale material deposition
US6811744B2 Forming structures from CAD solid models
US2003048314A1 Direct Write™ System
AU4796101A Modified absorption through unique composite materials and material combinations
WO0102160A1 Method for providing features enabling thermal management in complex three-dimensional structures