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SHIN ETSU ENG CO LTD

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    41,178
  • Filing trend
    ⇧ 50.0%
About

SHIN ETSU ENG CO LTD has a total of 38 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2016. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets semiconductors, machines and machine tools are PINK GMBH THERMOSYSTEME, HESSE GMBH and LASERSSEL CO LTD.

Patent filings per year

Chart showing SHIN ETSU ENG CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ohtani Yoshikazu 22
#2 Yokota Michiya 13
#3 Tomioka Kyouhei 9
#4 Mori Hiroharu 8
#5 Takahashi Hiroshi 8
#6 Furuya Masahiro 5
#7 Sato Kenji 4
#8 Awano Hidekazu 4
#9 Otani Yoshikazu 3
#10 Inaba Ryoichi 3

Latest patents

Publication Filing date Title
US2021098279A1 Substrate processing apparatus and substrate processing method
KR20210015662A Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method
JP2020109392A Inspection device and inspection method
WO2019244742A1 Workpiece separation device and workpiece separation method
JP2020177191A Bonding apparatus and bonding method of bonding device, and bonding device
WO2019220666A1 Workpiece separation device and workpiece separation method
JP2020080358A Inspection device and inspection method
JP2020027809A Workpiece transfer chuck and workpiece transfer method
JP2020027808A Workpiece transfer chuck and workpiece transfer method
JP2019184751A Laminated device manufacturing device and laminated device manufacturing method
JP2019138590A Heat treatment apparatus
JP2019138589A Heat treatment apparatus
JP2019138592A Heat treatment apparatus
JP2019100671A Heat treatment apparatus
WO2018074013A1 Apparatus for vacuum bonding of bonded device
JP2018112727A Work-piece bonding device, and work-piece bonding method
WO2018146755A1 Resin sealing device and resin sealing method
WO2018138915A1 Resin sealing device and resin sealing method
JP2018111226A Workpiece conveying apparatus and workpiece conveying method
US2019109021A1 Resin-sealing device and resin-sealing method