| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 7 | |
| #2 | WIPO (World Intellectual Property Organization) | 5 | |
| #3 | Germany | 4 | |
| #4 | United States | 4 | |
| #5 | Canada | 2 | |
| #6 | China | 2 | |
| #7 | Hungary | 2 | |
| #8 | Singapore | 2 | |
| #9 | Australia | 1 | |
| #10 | Czechia | 1 | |
| #11 | EAPO (Eurasian Patent Organization) | 1 | |
| #12 | Hong Kong | 1 | |
| #13 | Republic of Korea | 1 | |
| #14 | Mexico | 1 | |
| #15 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Audio-visual technology | |
| #4 | Environmental technology | |
| #5 | Thermal processes | |
| #6 | Machines | |
| #7 | Materials and metallurgy |
| # | Name | Total Patents |
|---|---|---|
| #1 | Oetzel Christoph | 19 |
| #2 | Hutzler Aaron | 12 |
| #3 | Weber Stefan | 8 |
| #4 | Clärding Sebastian | 5 |
| #5 | Ötzel Christoph | 4 |
| #6 | Clarding Sebastian | 2 |
| #7 | Pink Friedrich | 2 |
| #8 | Ulrich Holger | 2 |
| #9 | Kemper Alfred | 1 |
| #10 | Osterwald Frank | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2021069328A1 | System and method for connecting electronic assemblies | |
| EP3618994A1 | Soldering device and method for producing a solder connection, using base and pressure plates and a stop device | |
| CN110678288A | Method for producing a welded connection | |
| DE102017109748A1 | Soldering apparatus and method for making a solder joint | |
| DE102017109747A1 | Method of making a solder joint | |
| DE102016102162A1 | sintering apparatus | |
| MX2017007008A | Heat transfer device for producing a soldered connection of electrical components. | |
| EP1473532A2 | Rotary drying plant. | |
| DE10023137A1 | Cleaning system |