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ORMET CIRCUITS INC

Overview
  • Total Patents
    46
  • GoodIP Patent Rank
    60,146
  • Filing trend
    ⇧ 1100.0%
About

ORMET CIRCUITS INC has a total of 46 patent applications. It increased the IP activity by 1100.0%. Its first patent ever was published in 2002. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets materials and metallurgy, semiconductors and machine tools are AYUMI INDUSTRY CO LTD, AYUMI INDUSTRY and KOREA SEMICINDUCTOR SYSTEM CO LTD.

Patent filings per year

Chart showing ORMET CIRCUITS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shearer Catherine 18
#2 Shearer Catherine A 17
#3 Matthews Michael C 15
#4 Holcomb Kenneth C 14
#5 Friesen G Delbert 11
#6 Barber Eunsook 7
#7 Wrosch Matthew 6
#8 Matturri Peter A 5
#9 Matthews Michael 5
#10 Catherine Shearer 3

Latest patents

Publication Filing date Title
WO2021050453A1 Lithographically defined electrical interconnects from conductive pastes
US2020180233A1 Conductive film adhesive
US2020306894A1 Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging
EP3638439A2 Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof
CN107530836A The sintering paste with high metal loading capacity for semiconductor element attachment application
KR20160003635A Structures for z-axis interconnection of multilayer electronic substrates
WO2014082100A1 Alternative compositions for high temperature soldering applications
US2014131898A1 Semiconductor packaging containing sintering die-attach material
US2014120356A1 Conductive film adhesive
US2014042212A1 Electrically conductive compositions comprising non-eutectic solder alloys
KR20120096928A Preparation of metallurgic network compositions and methods of use thereof
KR20120032463A Conductive compositions containing blended alloy fillers
WO2008105867A1 Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias
US2003216061A1 Method of attaching circuitry to a modular jack connector using electrically conductive paste