| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 4 | |
| #2 | Republic of Korea | 3 | |
| #3 | United States | 3 | |
| #4 | China | 2 | |
| #5 | EPO (European Patent Office) | 2 | |
| #6 | Malaysia | 2 | |
| #7 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Basic materials chemistry | |
| #3 | Organic fine chemistry | |
| #4 | Macromolecular chemistry and polymers | |
| #5 | Optics | |
| #6 | Chemical engineering | |
| #7 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Soaps | |
| #2 | Semiconductor devices | |
| #3 | Acyclic or carbocyclic compounds | |
| #4 | Special macromolecular compounds | |
| #5 | Cleaning | |
| #6 | Photomechanical semiconductor production | |
| #7 | Working stone |
| # | Name | Total Patents |
|---|---|---|
| #1 | Beck Mark Jonathan | 12 |
| #2 | Jonathan Beck Mark | 4 |
| #3 | Mark Jonathan Beck | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2012071286A1 | Method for shaping and slicing ingots using an aqueous phosphate solution | |
| MY150211A | Particle removal cleaning method and composition | |
| WO2008097634A2 | Particle removal method and composition |