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OGANESIAN VAGE

Overview
  • Total Patents
    37
About

OGANESIAN VAGE has a total of 37 patent applications. Its first patent ever was published in 2010. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are HVVI SEMICONDUCTORS INC, JIANGSU CHANGJIANG ELECTRONICS and DAWNING LEADING TECH INC.

Patent filings in countries

World map showing OGANESIAN VAGEs patent filings in countries
# Country Total Patents
#1 United States 37

Patent filings per year

Chart showing OGANESIAN VAGEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Oganesian Vage 37
#2 Haba Belgacem 23
#3 Savalia Piyush 21
#4 Mohammed Ilyas 21
#5 Mitchell Craig 20
#6 Ovrutsky David 2
#7 Gao Guilian 2
#8 Lu Zhenhua 1

Latest patents

Publication Filing date Title
US2014070349A1 Low profile image sensor package
US2014027612A1 Integrated image sensor package with liquid crystal lens
US2013300009A1 Method of making stamped multi-layer polymer lens
US2013249031A1 Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making Same
US2013242155A1 Back side illuminated image sensor architecture, and method of making same
US2013188267A1 Multi-layer polymer lens and method of making same
US2013168791A1 Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making Same
US8432011B1 Wire bond interposer package for CMOS image sensor and method of making same
US2013127000A1 Interposer package for CMOS image sensor and method of making same
US2013056844A1 Stepped package for image sensor and method of making same
US2013020665A1 Low stress cavity package for back side illuminated image sensor, and method of making same
US2012313255A1 3D integration microelectronic assembly for integrated circuit devices
US2012313207A1 3D integration microelectronic assembly for integrated circuit devices
US2012313209A1 3D integrated microelectronic assembly with stress reducing interconnects
US2012273933A1 Three-dimensional system-in-a-package
US2012153488A1 Simultaneous wafer bonding and interconnect joining
US2012139124A1 Stacked microelectronic assembly with TSVs formed in stages with plural active chips
US2012139082A1 Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
US2012199924A1 Bsi image sensor package with variable light transmission for even reception of different wavelengths
US2012152433A1 Dual wafer spin coating