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NINGBO SEMICONDUCTOR INT CORP

Overview
  • Total Patents
    87
  • GoodIP Patent Rank
    16,493
About

NINGBO SEMICONDUCTOR INT CORP has a total of 87 patent applications. Its first patent ever was published in 2016. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, basic communication technologies and audio-visual technology are JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD, SEMICONDUCTOR MFG INTERNATIONAL (SHANGHAI) CORPORATION and ZHONGXIN INTEGRATED CIRCUIT NINGBO CO LTD.

Patent filings in countries

World map showing NINGBO SEMICONDUCTOR INT CORPs patent filings in countries

Patent filings per year

Chart showing NINGBO SEMICONDUCTOR INT CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Mengbin 34
#2 Luo Hailong 28
#3 Drowley Clifford Ian 16
#4 Xiang Yanghui 14
#5 Chen Da 9
#6 Shi Hu 7
#7 Wang Xiaochuan 5
#8 Huang He 5
#9 Yang Guohuang 4
#10 Yang Weicheng 4

Latest patents

Publication Filing date Title
CN112117985A Resonator and forming method thereof
CN112115759A Fingerprint identification module and forming method thereof
CN112115758A Fingerprint identification module, forming method thereof and electronic equipment
CN112117982A Packaging structure and manufacturing method thereof
US2020212028A1 Microcontroller unit and fabrication method thereof
CN112117195A Packaging method
CN112113899A Adhesive force detection method and detection system
CN112117186A Wafer cutting method
US2020198964A1 Packaging method and packaging structure
CN112117187A Etching method and etching system
CN112216671A Switching mechanism, manufacturing method thereof and packaging body
CN112216659A Integrated structure, manufacturing method thereof, electronic device and image sensor module
US2020273904A1 Cmos image sensor packaging structure and fabrication method thereof, and camera device
CN112117979A Resonator, method of manufacturing the same, filter, and electronic apparatus
CN112115753A Fingerprint identification module, manufacturing method thereof and electronic equipment
CN112054779A Film bulk acoustic resonator and method for manufacturing the same
CN111952199A Air gap type semiconductor device packaging structure and manufacturing method thereof
US2020161346A1 Image capturing assembly and packaging method thereof, lens module, and electronic device
US2020195248A1 Gate driver integrated circuit
US2020161359A1 Image capturing assembly and packaging method thereof, lens module and electronic device