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GREAT TEAM BACKEND FOUNDRY DONGGUAN LTD

Overview
  • Total Patents
    59
  • GoodIP Patent Rank
    25,046
  • Filing trend
    ⇧ 44.0%
About

GREAT TEAM BACKEND FOUNDRY DONGGUAN LTD has a total of 59 patent applications. It increased the IP activity by 44.0%. Its first patent ever was published in 2014. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, basic communication technologies and audio-visual technology are HUATONG COMPUTER CO LTD, SHIM IL KWON and CHANG CHIANG-CHENG.

Patent filings in countries

World map showing GREAT TEAM BACKEND FOUNDRY DONGGUAN LTDs patent filings in countries

Patent filings per year

Chart showing GREAT TEAM BACKEND FOUNDRY DONGGUAN LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Xiuru 37
#2 Cao Zhou 18
#3 Zhang Junyao 5
#4 Tang Heming 4
#5 Xu Zhenjie 4
#6 Hu Zhiyu 3
#7 Lin Kunxian 2
#8 Shi Zhehao 2
#9 Cheng Zhangming 1
#10 Guan Minghao 1

Latest patents

Publication Filing date Title
CN111933600A DBC substrate, DBC substrate manufacturing method and power module
CN111933599A Chip carrier and semiconductor packaging structure
CN111933597A DBC substrate, manufacturing method thereof, power module and power module heat dissipation system
CN111933596A Chip carrier and semiconductor packaging product comprising same
CN111933598A Heat dissipation type chip carrier and heat dissipation type semiconductor packaging product
CN111933594A Power semiconductor structure and packaging method thereof
CN111933595A Semiconductor packaging structure and manufacturing method thereof
CN111987001A Manufacturing method of power semiconductor structure, chip carrier and power semiconductor structure
CN111725181A Semiconductor combination structure, control method and electronic product
CN111725153A Substrate-free system-in-package structure, method and electronic product
CN111725159A High-heat-dissipation semiconductor product, packaging method and electronic product
CN111725160A High-power semiconductor module, packaging method and electronic product
CN111725084A Semiconductor device and packaging method thereof
CN111725145A Semiconductor packaging structure, packaging method and electronic product
CN111725085A Semiconductor device and packaging method thereof
CN111725161A Semiconductor heat dissipation device, packaging method and electronic product
CN111725178A Substrate-free chip stacking and packaging structure and method and electronic product
CN111725173A Stack packaging structure and manufacturing method thereof
CN111725076A Packaging method for preventing exposed heat dissipation plate from being tinned
CN111640710A Packaged semiconductor, packaging method and electronic product