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DBC substrate, DBC substrate manufacturing method and power module
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Chip carrier and semiconductor packaging structure
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DBC substrate, manufacturing method thereof, power module and power module heat dissipation system
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Chip carrier and semiconductor packaging product comprising same
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Heat dissipation type chip carrier and heat dissipation type semiconductor packaging product
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Power semiconductor structure and packaging method thereof
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Semiconductor packaging structure and manufacturing method thereof
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Manufacturing method of power semiconductor structure, chip carrier and power semiconductor structure
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Semiconductor combination structure, control method and electronic product
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Substrate-free system-in-package structure, method and electronic product
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High-heat-dissipation semiconductor product, packaging method and electronic product
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High-power semiconductor module, packaging method and electronic product
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Semiconductor device and packaging method thereof
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Semiconductor packaging structure, packaging method and electronic product
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Semiconductor device and packaging method thereof
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Semiconductor heat dissipation device, packaging method and electronic product
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Substrate-free chip stacking and packaging structure and method and electronic product
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Stack packaging structure and manufacturing method thereof
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Packaging method for preventing exposed heat dissipation plate from being tinned
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Packaged semiconductor, packaging method and electronic product
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