| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 11 | |
| #2 | United States | 9 | |
| #3 | Japan | 6 | |
| #4 | WIPO (World Intellectual Property Organization) | 5 |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Domestic heating systems | |
| #3 | Refrigerators | |
| #4 | Coating metallic material | |
| #5 | Waveguides | |
| #6 | Circuits for supplying electric power | |
| #7 | Resonators |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kang In Soo | 9 |
| #2 | Park Yun Mook | 8 |
| #3 | Choi Joon Young | 5 |
| #4 | Jung Gi-Jo | 4 |
| #5 | Jung Gi Jo | 4 |
| #6 | Park Byung Jin | 3 |
| #7 | Baek Seung Dae | 3 |
| #8 | Kim Jong Heon | 3 |
| #9 | Park Yun-Mook | 2 |
| #10 | Park Byung-Jin | 2 |
| Publication | Filing date | Title |
|---|---|---|
| JP2011233854A | Wafer level semiconductor package and fabrication method thereof | |
| WO2007064073A1 | Bump with multiple vias for semiconductor package, method of fabrication method thereof, and semiconductor package using the same |