Learn more

NANTONG TONGFU MICROELECTRONICS CO LTD

Overview
  • Total Patents
    52
  • GoodIP Patent Rank
    28,525
About

NANTONG TONGFU MICROELECTRONICS CO LTD has a total of 52 patent applications. Its first patent ever was published in 2016. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, computer technology and optics are CHIEN CHIN-CHENG, GLOBALFOUNDRIES DRESDEN MOD 1 and INT RECTIFIER CORP JAPAN.

Patent filings in countries

World map showing NANTONG TONGFU MICROELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 48
#2 WIPO (World Intellectual Property Organization) 4

Patent filings per year

Chart showing NANTONG TONGFU MICROELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shi Lei 14
#2 Dai Ying 13
#3 Li Jun 8
#4 Wang Yaochen 8
#5 Tao Yujuan 7
#6 Miao Xiaoyong 5
#7 Shi Peipei 4
#8 Li Shangxuan 4
#9 Bai Youqi 4
#10 Jiang Yan 4

Latest patents

Publication Filing date Title
CN111863719A Chip interconnection method
CN111863794A Semiconductor packaging device
CN111863795A Semiconductor packaging body and chip packaging body
CN111863791A Semiconductor packaging body and chip packaging body
CN111883439A Chip packaging method
CN111863641A Chip packaging method
CN111863796A Semiconductor packaging device
CN111863718A Chip interconnection method
CN111863717A Chip interconnection method
CN111863792A Semiconductor packaging body and chip packaging body
CN111863715A Chip interconnection method
CN111883480A Chip interconnection method
CN111863640A Chip packaging method
CN111863790A Semiconductor packaging device
CN111863793A Semiconductor packaging device and chip interconnection method
CN111863738A Semiconductor packaging device
CN111863716A Chip interconnection method
WO2021013097A1 Packaging structure and formation method thereof
WO2021017897A1 Packaging structure and fabrication method thereof
WO2021017895A1 Packaging structure and fabrication method thereof