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MUTUAL PAK TECHNOLOGY CO LTD

Overview
  • Total Patents
    35
  • GoodIP Patent Rank
    182,045
About

MUTUAL PAK TECHNOLOGY CO LTD has a total of 35 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, audio-visual technology and computer technology are ABBOTT DONALD C, STANDING MARTIN and BOOTH JR ROGER A.

Patent filings in countries

World map showing MUTUAL PAK TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 16
#2 United States 14
#3 China 3
#4 Japan 2

Patent filings per year

Chart showing MUTUAL PAK TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hwan Lu-Chen 20
#2 Hwan Lu Chen 9
#3 Chen P C 7
#4 Chen Po Ching 7
#5 Ma Yu-Lin 5
#6 Liu Tai-Hui 3
#7 Chen Boqin 3
#8 Huang Zuqian 2
#9 Ma Yu Lin 2
#10 Lee Kun-Chui 2

Latest patents

Publication Filing date Title
TWI677932B Expansion method of stretch film and expander thereof
TWI677976B Composite layer structure of luminous imaging unit
TW202002320A Vertical light-emitting diode structure and method of manufacturing the same
TW202002736A Circuit board and manufacturing method thereof
TWI648886B Light-emitting diode structure
TW201526187A Chip element and chip package
CN104733414A Chip component and chip packaging body
CN104636790A Electronic tag
TW201519107A Radio frequency identification tag
CN104636788A RFID (radio frequency identification) tag
TW201324368A Radio frequency identification tag and cloth having the same
TW201015092A Test module for radio frequency identification chips and method of the same
TW201005990A Light emitting diode and method of the same
TW200952135A Integrated circuit package module and method of the same
TW200945526A Package structure for integrated circuit device and method of the same
TW200845201A Package structure for integrated circuit device and method of the same
TW200835047A Integrated circuit device having antenna conductors and the mothod for the same
US2007048901A1 Wafer-level package and IC module assembly method for the wafer-level package
US2006234460A1 Method for making cable with a conductive bump array, and method for connecting the cable to a task object
TW200527998A Method for making cable with a conductive bump array, and method for connecting the cable to a task object