COOKSON ELECTRONICS INC has a total of 26 patent applications. Its first patent ever was published in 2002. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are UNITED TEST CT INC, KANTO SANYO SEMICONDUCTORS CO and TESSERA INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 11 | |
#2 | WIPO (World Intellectual Property Organization) | 6 | |
#3 | EPO (European Patent Office) | 4 | |
#4 | Australia | 2 | |
#5 | Japan | 2 | |
#6 | Republic of Korea | 1 |
# | Name | Total Patents |
---|---|---|
#1 | Gilleo Kenneth B | 17 |
#2 | Rae Alan | 6 |
#3 | Singh Bawa | 6 |
#4 | Lewis Brian | 4 |
#5 | Gulino Angelo J | 4 |
#6 | Holtzer Mitch | 3 |
#7 | Abys Joe | 3 |
#8 | Slim Siman | 3 |
#9 | Varnell William D | 3 |
#10 | Mclenaghan Allen J | 1 |
Publication | Filing date | Title |
---|---|---|
US2005151555A1 | Cooling devices and methods of using them | |
US2006035413A1 | Thermal protection for electronic components during processing | |
US2005070131A1 | Electrical circuit assembly with micro-socket | |
US2004108588A1 | Package for microchips | |
US2005056946A1 | Electrical circuit assembly with improved shock resistance | |
US2005012212A1 | Reconnectable chip interface and chip package | |
US2004163717A1 | MEMS device assembly | |
US2004074089A1 | Releasable microcapsule and adhesive curing system using the same | |
US6838372B2 | Via interconnect forming process and electronic component product thereof |