| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 23 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Materials and metallurgy | |
| #5 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kyo Eikyoku | 11 |
| #2 | Heo Young Wook | 3 |
| #3 | Shim Il Kwon | 2 |
| #4 | Tei Eiseki | 2 |
| #5 | Chin Ichiken | 2 |
| #6 | Chin Itsukken | 2 |
| #7 | Bun Eiyo | 1 |
| #8 | Kan Heizuun | 1 |
| #9 | Kan Heishun | 1 |
| #10 | Ra Ginko | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JPH10200012A | Package of ball grid array semiconductor and its manufacturing method | |
| JPH10200011A | Flexible circuit board for ball-grid array semiconductor package | |
| JPH1032279A | Bump forming method of bump chip scale semiconductor package, semiconductor package, and bump | |
| JPH1092882A | Wafer map transforming method |