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Semiconductor chip assembly and method for making same
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Flip chip assembly and process with sintering material on metal bumps
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Electrical barrier layers
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Single exposure in multi-damascene process
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Low cost hybrid high density package
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Systems and methods for producing flat surfaces in interconnect structures
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Reliable wire method
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Packaged semiconductor chips with array
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Packaged microelectronic elements having blind vias for heat dissipation
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Reliable packaging and interconnect structures
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Multiple die stacking for two or more die
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Multiple die face-down stacking for two or more die
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Ultra-thin near-hermetic package based on rainier
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System and microelectronic assembly of multiple die face-down stacking for two or more die
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Electrohydrodynamic (ehd) fluid mover with collector electrode leading surface shaping for spatially selective field reduction
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Electrohydrodynamic (ehd) fluid mover with field blunting structures in flow channel for spatially selective suppression of ion generation
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Multiple die face-down stacking for two or more die
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Electrohydrodynamic (ehd) air mover configuration with flow path expansion and/or spreading for improved ozone catalysis
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Multiple die stacking for two or more die
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Emitter wire with layered cross-section
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