TW454315B
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Structure and manufacturing method of integrated circuit package body
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Electronic device package with enhanced heat dissipation effect
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Heat spreader for ball grid array package
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TW546514B
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Liquid crystal display module structure
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KR20010002279A
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Method for protecting chip wire bonds of integrated circuit
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TW421835B
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Semiconductor package with enhanced heat dissipation and electric properties
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Heat sink
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Electronic device cooling arrangement
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Indicating adhesion status between substrate and encapsulant of a packaged electronic device
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Chip scale package
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EP0948047A2
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Electronic component cooling arrangement
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EP0948048A1
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Chip scale package
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Method of repairing a substrate array
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TW362265B
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Process for splitting the runners of laminate electric component packaging
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Method of connecting TEHS on PBGA and modified connecting structure
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