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MK ELECTRON CO LTD

Overview
  • Total Patents
    153
  • GoodIP Patent Rank
    25,229
  • Filing trend
    ⇩ 75.0%
About

MK ELECTRON CO LTD has a total of 153 patent applications. It decreased the IP activity by 75.0%. Its first patent ever was published in 1999. It filed its patents most often in Republic of Korea, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, materials and metallurgy and machine tools are SHANGHAI WEISONG INDUSTRY AUTOMATION CO LTD, ORTHODYNE ELECTRONICS CORP and F&K DELVOTEC BONDTECHNIK GMBH.

Patent filings per year

Chart showing MK ELECTRON CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Moon Jeong Tak 73
#2 Hong Sung Jae 38
#3 Cho Jong Soo 33
#4 Heo Young Il 23
#5 Lee Young Woo 19
#6 Kim Sang Yeob 18
#7 Kim Seung Hyoun 16
#8 Moon Jeong-Tak 14
#9 Hong Soon Ho 13
#10 Son Jae Yeol 12

Latest patents

Publication Filing date Title
KR20190099358A Spool case for bonding wire and method for manufacturing the same
WO2019022318A1 Anode active material for secondary battery, and preparation method therefor
KR20190074832A Bonding wire
WO2019059438A1 Secondary battery anode active material and manufacturing method therefor
WO2018159870A1 Negative electrode active material for secondary battery and manufacturing method therefor
WO2018155744A1 Anode active material, secondary battery comprising same, and anode active material manufacturing method
KR20160135154A Silver alloy bonding wire and manufacturing method thereof
KR101812943B1 Bonding wire
KR20160125330A Anode active material for secondary battery and method of manufacturing the same
US2016315040A1 Core for reverse reflow, semiconductor package, and method of fabricating semiconductor package
US2016244891A1 Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder bump
KR20160103922A Solder ball for fluxless bonding, method of manufacturing the same, and method of forming a solder bump
KR20160126839A Core for reverse reflow, semiconductor package, and method of fabricating a semiconductor package
KR20160131456A Silver alloy bonding wire and manufacturing method thereof
KR101558140B1 Drawing apparatus for wires
KR20160107005A Lead-free solder having low melting point
KR20160089161A Bonding wire
KR20160059740A Anode active material for secondary battery and method of manufacturing the same
KR20160030777A Silver alloy bonding wire and manufacturing method thereof
KR20160002206A Solder ball and a semiconductor device employing the same