| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 5 | |
| #2 | United States | 3 | |
| #3 | China | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Machines | |
| #4 | Optics |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Soldering, welding and flame cutting | |
| #3 | Unspecified technologies | |
| #4 | Working stone | |
| #5 | Sawing | |
| #6 | Devices using light amplification |
| # | Name | Total Patents |
|---|---|---|
| #1 | Sadler Richard D | 2 |
| #2 | Miller Amir | 1 |
| #3 | Licht Oded Yehoshua | 1 |
| #4 | Babinetz Stephen | 1 |
| #5 | Yakov Ragaabaumu | 1 |
| #6 | Dury Kenneth Kyle | 1 |
| #7 | Clauberg Horst | 1 |
| #8 | Otsubo Hiroyuki | 1 |
| #9 | Kyle Beatson David Thomas Clau | 1 |
| #10 | Beatson David Thomas | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2002157657A1 | Dicing method and apparatus for cutting panels or wafers into rectangular shaped die | |
| US6523733B2 | Controlled attenuation capillary |