| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 16 | |
| #2 | China | 5 | |
| #3 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Micro-structure and nano-technology | |
| #3 | Audio-visual technology | |
| #4 | Measurement | |
| #5 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tu Ming-Te | 14 |
| #2 | Du Mingde | 5 |
| #3 | Yeh Yao-Ting | 4 |
| #4 | Lin Ching-I | 4 |
| #5 | Liao Hsien-Ken | 3 |
| #6 | Tian Jyong-Yue | 3 |
| #7 | Lin Jingyi | 3 |
| #8 | Yu Chao-Wei | 2 |
| #9 | Yeh Yao Ting | 2 |
| #10 | Tu Ming Te | 2 |
| Publication | Filing date | Title |
|---|---|---|
| CN111769107A | Light sensing module packaging structure | |
| US2020109044A1 | Microelectromechanical microphone package structure | |
| US2020105636A1 | Chip package structure having function of preventing adhesive from overflowing | |
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| CN108269796A | The encapsulating structure and its packaging method of remote pickup |