| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | Taiwan | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | Republic of Korea | 2 |
| # | Industry | |
|---|---|---|
| #1 | Micro-structure and nano-technology | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Loudspeakers and microphones | |
| #2 | Semiconductor devices | |
| #3 | Microstructural devices | |
| #4 | Making microstructural devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Wang Zhe | 8 |
| #2 | Zhe Wang | 5 |
| #3 | Miao Yubo | 4 |
| #4 | Yubo Miao | 4 |
| #5 | Chong Ser Choong | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2007205492A1 | MEMS microphone with a stacked PCB package and method of producing the same | |
| US2007013036A1 | MEMS package using flexible substrates, and method thereof | |
| US2006093171A1 | Silicon microphone with softly constrained diaphragm | |
| US2006093170A1 | Backplateless silicon microphone |