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LEE SANG-YUN

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    229,940
About

LEE SANG-YUN has a total of 36 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and machines are SCHEIPER THILO, YANG WEN-KUN and KRONHOLZ STEPHAN.

Patent filings in countries

World map showing LEE SANG-YUNs patent filings in countries

Patent filings per year

Chart showing LEE SANG-YUNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Sang-Yun 36
#2 Shin Bum-Soo 1
#3 Hahm Hee-Hyeok 1
#4 Noh Myung Keun 1
#5 Ju Jae-Young 1
#6 Oh Heaungshig 1
#7 Jung Sung-Woo 1
#8 Joo Young-Ho 1
#9 Lim Ssang-Gun 1
#10 Kang Mingu 1

Latest patents

Publication Filing date Title
WO2015008954A1 Bracket assembly for bath accessories enabling small items to be placed thereon
US2011003438A1 Three-dimensional integrated circuit structure
US2011001172A1 Three-dimensional integrated circuit structure
US2011053332A1 Semiconductor circuit
US2011291234A1 Semiconductor circuit structure and method of making the same
US2011285027A1 Semiconductor circuit structure and method of forming the same using a capping layer
US2010190334A1 Three-dimensional semiconductor structure and method of manufacturing the same
US2010133695A1 Electronic circuit with embedded memory
US2011143506A1 Method for fabricating a semiconductor memory device
US2010112753A1 Semiconductor memory device
US2010038743A1 Information storage system which includes a bonded semiconductor structure
US2009325343A1 Bonded semiconductor structure and method of fabricating the same
US2009267233A1 Bonded semiconductor structure and method of making the same
US2009111241A1 Wafer bonding method
US2008032463A1 Semiconductor memory device
US2007077694A1 Three-dimensional integrated circuit structure
US2005280156A1 Semiconductor device with base support structure
US2005280042A1 Wafer bonding method
US2005280155A1 Semiconductor bonding and layer transfer method
US2005282356A1 Semiconductor layer structure and method of making the same