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YANG WEN-KUN

Overview
  • Total Patents
    19
About

YANG WEN-KUN has a total of 19 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States and Taiwan. Its main competitors in its focus markets semiconductors and computer technology are SCHEIPER THILO, KRONHOLZ STEPHAN and BEYER SVEN.

Patent filings in countries

World map showing YANG WEN-KUNs patent filings in countries
# Country Total Patents
#1 United States 18
#2 Taiwan 1

Patent filings per year

Chart showing YANG WEN-KUNs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Yang Wen-Kun 19
#2 Yang Wen-Pin 3
#3 Chen Shih-Li 3
#4 Wang Tung-Chuan 2
#5 Lin Diann-Fang 1
#6 Hsu Hsien-Wen 1
#7 Yu Chun-Hui 1
#8 Chang Jui-Hsien 1
#9 Lin Chihwei 1
#10 Chou Chao-Nan 1

Latest patents

Publication Filing date Title
US2012043635A1 Image sensor package with dual substrates and the method of the same
US2012153299A1 LED chip
US2010301474A1 Semiconductor device package structure and method for the same
US2012037935A1 Substrate Structure of LED (light emitting diode) Packaging and Method of the same
US2010072606A1 Stacking package structure with chip embedded inside and die having through silicon via and method of the same
US2010072588A1 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
US2008237879A1 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same
US2008197478A1 Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same
US2008174008A1 Structure of Memory Card and the Method of the Same
US2008157336A1 Wafer level package with die receiving through-hole and method of the same
US7459781B2 Fan out type wafer level package structure and method of the same
TW466652B Wafer level package and its process thereof